Mechanisms for forming stressor regions in a semiconductor device

ABSTRACT

A method of manufacturing a semiconductor device includes performing a pre-amorphous implantation (PAI) process to form an amorphized region on a substrate. The method also includes forming a stress film over the substrate, and performing an annealing process to recrystallize the amorphized region after the stress film is formed. The method further includes forming a recess region on the substrate. The recess region overlies the recrystallized region. The method additionally includes forming an epitaxial stress-inducing material in the recess region.

PRIORITY CLAIM

The present application is divisional of U.S. application Ser. No.13/324,331, filed Dec. 13, 2011, which is incorporated by referenceherein in its entirety.

RELATED APPLICATIONS

The present application is related to U.S. patent application Ser. No.13/177,309, filed Jul. 6, 2011, and U.S. patent application Ser. No.13/029,378, filed Feb. 17, 2011, both of which are incorporated hereinby reference in their entireties. The present application is alsorelated to U.S. patent application Ser. No. 13/324,257, filed Dec. 13,2011, which is also incorporated herein by reference in its entirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. In the course of IC evolution, functional density (i.e., thenumber of interconnected devices per chip area) has generally increasedwhile geometry size (i.e., the smallest component (or line) that can becreated using a fabrication process) has decreased. This scaling downprocess generally provides benefits by increasing production efficiencyand lowering associated costs. Such scaling down has also increased thecomplexity of processing and manufacturing ICs and, for these advancesto be realized, similar developments in IC manufacturing are needed.

For example, as semiconductor devices, such as ametal-oxide-semiconductor field-effect transistors (MOSFETs), are scaleddown through various technology nodes, strained source/drain features(e.g., stressor regions) have been implemented to enhance carriermobility and improve device performance. Stress distorts or strains thesemiconductor crystal lattice, which affects the band alignment andcharge transport properties of the semiconductor. By controlling themagnitude and distribution of stress in a finished device, manufacturerscan increase carrier mobility and improve device performance. Althoughexisting approaches to forming stressor regions for IC devices have beengenerally adequate for their intended purposes, they have not beenentirely satisfactory in all respects.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a flowchart illustrating a method of forming a semiconductordevice according to various aspects of the present disclosure.

FIGS. 2 to 8 illustrate diagrammatic cross-sectional side views of oneor more embodiments of a semiconductor device at various stages offabrication according to the method of FIG. 1.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed. It is understoodthat those skilled in the art will be able to devise various equivalentsthat, although not explicitly described herein, embody the principles ofthe present invention.

Examples of devices that can benefit from one or more embodiments of thepresent invention are semiconductor devices with field effecttransistors (FET). Such a device, for example, is a complementarymetal-oxide-semiconductor (CMOS) field effect transistor. The followingdisclosure will continue with this example to illustrate variousembodiments of the present invention. It is understood, however, thatthe invention should not be limited to a particular type of device,except as specifically claimed.

With reference to FIGS. 1 and 2-8, a method 100 and a semiconductordevice 200 are collectively described below. The semiconductor device200 illustrates an integrated circuit, or portion thereof. In someembodiments, the semiconductor device 200 comprises active devices suchas metal-oxide-semiconductor field effect transistors (MOSFETs),complementary metal-oxide-semiconductor (CMOS) transistors, high voltagetransistors, and/or high frequency transistors; other suitablecomponents; and/or combinations thereof. In some embodiments, thesemiconductor device 200 additionally includes passive components, suchas resistors, capacitors, inductors, and/or fuses. In some embodiments,the semiconductor device 200 is formed by CMOS technology processing,and thus some processes are not described in detail herein. In someembodiments, additional steps are provided before, during, and after themethod 100, and some of the steps described below can be replaced oreliminated, for additional embodiments of the method. In someembodiments, additional features are added in the semiconductor device200, and some of the features described below are replaced oreliminated, for additional embodiments of the semiconductor device 200.

Referring to FIG. 1, a method 100 for fabricating a semiconductor deviceis described according to various aspects of the present disclosure. Themethod 100 begins with step 102 in which a substrate is provided. Thesubstrate includes a gate structure with a gate stack. The method 100continues with step 104 in which a pre-amorphous implantation (PAI)process is performed on the substrate. The method 100 continues at step106 in which a stress film is deposited on the substrate. The method 100continues at step 108 in which an anneal process is performed on thesubstrate. The method 100 continues at step 110 in which the stress filmis removed. The method 100 continues at step 112 in which a recessregion is formed on the substrate by etching. The method 100 continuesat step 114 in which an epitaxial growth is performed on the substrate.The discussion that follows illustrates various embodiments of asemiconductor device 200 that can be fabricated according to the method100 of FIG. 1.

FIGS. 2 to 8 illustrate diagrammatic cross-sectional side views of oneor more embodiments of a semiconductor device 200 at various stages offabrication according to the method 100 of FIG. 1. Referring to FIG. 2,the semiconductor device 200 includes a substrate 210. In the presentembodiment, the substrate 210 is a semiconductor substrate includingsilicon. Alternatively, the substrate 210 includes an elementarysemiconductor including silicon and/or germanium in crystal; a compoundsemiconductor including silicon carbide, gallium arsenic, galliumphosphide, indium phosphide, indium arsenide, and/or indium antimonide;an alloy semiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GaInAs,GaInP, and/or GaInAsP; or combinations thereof. In some embodiments,where the substrate 210 is an alloy semiconductor; the alloysemiconductor substrate has a gradient SiGe feature in which the Si andGe composition change from one ratio at one location to another ratio atanother location of the gradient SiGe feature. In some embodiments, thealloy SiGe is formed over a silicon substrate, and/or the SiGe substrateis strained. In yet another alternative, the semiconductor substrate isa semiconductor on insulator (SOI).

The substrate 210 includes various doped regions depending on designrequirements as known in the art (e.g., p-type wells or n-type wells).The doped regions are doped with p-type dopants, such as boron or BF₂,and/or n-type dopants, such as phosphorus or arsenic. In someembodiments, the doped regions are formed directly on the substrate 210,in a P-well structure, in an N-well structure, in a dual-well structure,or using a raised structure. The doped regions include various activeregions, such as regions configured for an N-typemetal-oxide-semiconductor transistor (referred to as an NMOS) andregions configured for a P-type metal-oxide-semiconductor transistor(referred to as a PMOS).

In some embodiments, the substrate 210 includes an isolation region todefine and isolate various active regions of the substrate 210. Theisolation region utilizes isolation technology, such as shallow trenchisolation (STI) or local oxidation of silicon (LOCOS), to define andelectrically isolate the various regions. The isolation region includessilicon oxide, silicon nitride, silicon oxynitride, other suitablematerials, or combinations thereof.

With further reference to FIG. 2, the substrate 210 includes gatestructures 220 disposed over channel regions. In some embodiments, thesubstrate 210 further includes a source region and a drain region onboth sides of one of the gate structures 220, the channel region beingthe region between the source region and the drain region. In someembodiments, lightly-doped drains (LDDs) are formed in substrate 210. Insome embodiments, portions of the LDDs are formed under the gatestructures 220. For NMOS transistors, N-type lightly-doped drains(LDDs), are formed of n-type dopants, such as phosphorous, arsenic,and/or other group V elements. In some embodiments, P-type pocket dopedregions are also formed in substrate 210.

The gate structure 220 includes various gate material layers. In thepresent embodiment, the gate structure 220 includes a gate stack 222,which includes one or more gate dielectric layer and a gate electrode.In some embodiments, the gate structure 220 also includes gate spacers224 disposed on sidewalls of the gate stack 222. In some embodiments,the gate structure 220 is divided into two substantially equal halves byan imaginary center line 226.

The gate stack 222 is formed over the substrate 210 to a suitablethickness. In an example, the gate stack 222 includes a polycrystallinesilicon (or polysilicon) layer. In some embodiments, the polysiliconlayer is doped for proper conductivity. Alternatively, the polysiliconis not necessarily doped, for example, if a dummy gate is to be formedand later replaced by a gate replacement process. In another example,the gate stack 222 includes a conductive layer having a proper workfunction; therefore, the gate stack 222 is also referred to as a workfunction layer. The work function layer includes a suitable material,such that the layer is tuned to have a proper work function for enhancedperformance of the device. For example, if an N-type work function metal(N-metal) for an NMOS device is desired, Ta, TiAl, TiAlN, or TaCN, isused. In some embodiments, the work function layer includes dopedconducting oxide materials. In some embodiments, the gate stack 222includes other conductive materials, such as aluminum, copper, tungsten,metal alloys, metal silicide, other suitable materials, and/orcombinations thereof. In some embodiments, the gate stack 222 includesmultiple layers. For example, where the gate stack 222 includes a workfunction layer, another conductive layer is formed over the workfunction layer. In some embodiments, the gate stack 222 is formed bychemical vapor deposition (CVD), physical vapor deposition (PVD), atomiclayer deposition (ALD), high density plasma CVD (HDPCVD), plating, othersuitable methods, and/or combinations thereof.

The gate spacers 224 are formed over the substrate 210 by any suitableprocess to any suitable thickness. The gate spacers 224 include adielectric material, such as silicon nitride, silicon oxide, siliconoxynitride, other suitable materials, and/or combinations thereof. Insome embodiments, the gate spacers 224 are used to offset subsequentlyformed doped regions, such as heavily doped source/drain regions.

Referring to FIG. 3, a pre-amorphous implantation (PAI) process 230 isperformed on the substrate 210. The PAI process 230 implants thesubstrate 210 with some species. The implanted species damage thelattice structure of the substrate 210 and form an amorphized region232. In some embodiments, the implanted species scatter in substrate210. The scattered species cause lateral amorphization, which results inamorphized region 232 extending to regions underneath the spacers 224.In some embodiments, the amorphized region 232 is formed in a source anddrain region of the semiconductor device 200 and does not extend beyondthe center line 226 of the gate structure 220. The amorphized region 232has a depth 234. The amorphized depth 234 is formed according to designspecifications. In some embodiments, the amorphized depth 234 is in arange from about 10 to about 150 nanometers. In some embodiments, theamorphized depth 234 is less than about 100 nanometers.

In some embodiments, the amorphized depth 234 is controlled by thethickness of the gate spacers 224, because the gate spacers 224 serve toconcentrate the PAI process 230 implantation energy away from the centerline 226 of the gate structure 220, thereby allowing for a deeperamorphized depth 234. In addition, the amorphized depth 234 iscontrolled by parameters of the PAI process 230, such as implant energy,implant species, and implant dosage, etc. The PAI process 230 implantsthe substrate 210 with silicon (Si) or germanium (Ge), in accordancewith some embodiments. In some embodiments, other implant speciesheavier than Si are used. For example, in some embodiments, the PAIprocess 230 utilizes other implant species, such as Ar, Xe, BF₂, As, In,other suitable implant species, or combinations thereof. In someembodiments, the PAI process 230 implants species at an implant energyin a range from about 20 KeV to about 60 KeV. In some embodiments, thePAI process 230 implants species at a dosage ranging in a range fromabout 1×10¹⁴ atoms/cm² to about 2×10¹⁵ atoms/cm², depending on theimplantation temperature. Lower implantation temperature enhancesimplant amorphization efficiency. In some embodiments, the implanttemperature is in a range from about −100° C. to about 25° C. (or roomtemperature).

In some embodiments, a patterned photoresist layer is utilized to definewhere the amorphized region 232 is formed and protect other regions ofthe semiconductor device 200 from implantation damage. For example, thePMOS regions are protected. In addition, the patterned photoresist layerexposes the source/drain regions, such that the source/drain regions areexposed to the PAI process 230 (forming amorphized region 232) while thegate structure 220 (and other portions of the semiconductor device 200)are protected from the PAI process 230. Alternatively, a patterned hardmask layer, such as a SiN or SiON layer, is utilized to define theamorphized region. In some embodiments, the patterned photoresist layeror the patterned hard mask layer is part of the current manufacturingprocess, for example lightly-doped drains (LDD) or source/drainformation, thereby minimizing cost as no additional photoresist layer orhard mask is required for the PAI process 230. After the PAI process isperformed, the photoresist on substrate 210 is removed.

Referring to FIG. 4, a stress film 240 is deposited over the substrate210. In some embodiments, the stress film 240 is formed by chemicalvapor deposition (CVD), physical vapor deposition (PVD), atomic layerdeposition (ALD), high density plasma CVD (HDPCVD), plating, othersuitable methods, and/or combinations thereof. In some embodiments, thestress film 240 includes a dielectric material, such as silicon nitride,silicon oxide, silicon oxynitride, other suitable materials, and/orcombinations thereof. The stress film 240 has tensile stress, whichaffects the recrystallization process. For example, the stress film 240could retard the growth rate in the [110] direction of the stressorregions 252. In some embodiments, the stress film 240 is not used.

Still referring to FIG. 4, an annealing process 250 is performed on thesubstrate 210. The annealing process 250 causes the amorphized regions232 to re-crystallize, forming stressor regions 252. This process isoften referred to as solid-phase epitaxy (SPE), and thus, the stressorregions 252 are referred to as epi regions. The stressor regions 252are, for example, epitaxial SiP stressor regions, epitaxial SiC, or SiCPstressor regions, in accordance with some embodiments. SiC stands forcarbon-containing silicon and SiCP stands forcarbon-and-phosphorous-containing silicon. In some embodiments, thecarbon concentration is less than about 3 atomic %. In some embodiments,the P concentration is in a range from about 5E19 1/cm³ to about 5E211/cm³. In some embodiments, the P and/or C in silicon in the epitaxialstressor regions are implanted at previous operations. In someembodiments, carbon is implanted into a silicon substrate to create aSiC stressor, which is compressive and applies a tensile strain to theNMOS transistor channel region due to the small size of carbon (C) incomparison to silicon (Si). In addition, in some embodiments, thecompressive film stress in the stressor regions assists the initiationof pinchoff. In some embodiments, P is doped to lower the resistance ofthe source and drain regions. In addition, in some embodiments, carbonimpedes the out-diffusion of P.

In some embodiments, the annealing process 250 is a furnace process, arapid thermal annealing (RTA) process, a millisecond thermal annealing(MSA) process (for example, a millisecond laser thermal annealingprocess), or a micro-second thermal annealing (μSA) process. In someembodiments, the annealing process includes a pre-heat operation whichminimizes or even eliminates end of range (EOR) defects, which are theremained defects at the amorphous/crystalline interface. The pre-heatoperation is performed at a temperature from about 200° C. to about 700°C., in accordance with some embodiments. The pre-heat operation isperformed in a range from about 10 seconds to about 10 minutes, in someembodiments.

The main anneal of the annealing process 250 is performed at atemperature in a range from about 800° C. to about 1,400° C. Dependingon the type of annealing process and the temperature utilized, the mainanneal of the annealing process 250 is performed for a duration in arange from about 1 millisecond to about 5 hours, in some embodiments.For example, the pre-heat operation is at a temperature of about 550° C.for about 180 seconds. If the annealing process 250 is a RTA process, insome embodiments, the main anneal temperature is equal to or greaterthan about 950° C. and is performed for a duration in a range from about0.5 second to about 5 seconds, in some embodiments. If the annealingprocess 250 is a MSA process, in some embodiments, the main annealtemperature is up to a Si melting point of about 1,400° C. and isperformed for a few milliseconds or less, for example for about 0.8milliseconds to about 100 milliseconds.

During the annealing process 250, as the substrate 210 recrystallizes,dislocations 260 are formed in the stressor region 252. In someembodiments, the dislocations 260 are formed in the [111] direction. Insome embodiments, the [111] direction has an angle in a range from about45 to about 65 degrees, the angle being measured with respect to an axisparallel to a surface of the substrate 210.

The dislocations 260 start formation at pinchoff points 262. In someembodiments, the pinchoff points 262 are formed in the stressor region252 at a depth of about 10 to about 150 nanometers, the depth beingmeasured from the surface of the substrate 210. The pinchoff points 262have a horizontal buffer 264 and a vertical buffer 266. The horizontalbuffer 264 and the vertical buffer 266 are formed according to designspecifications and are affected by the annealing process 250. Thepinchoff points 262 have a horizontal buffer 264 of about 5 to about 20nanometers and a vertical buffer 266 of about 10 to about 40 nanometers,in some embodiments. In some embodiments, the pinchoff points 262 areformed such that the pinchoff points 262 are not disposed within thechannel region.

Referring to FIG. 5, the stress film 240 is removed from the substrate210. In some embodiments, the gate spacers 224 are also removed from thegate structure 220. The stress film 240 and optionally the gate spacers224 are removed by an etching process. In some embodiments, the etchingprocess is performed by wet etching, such as by using phosphoric acid orhydrofluoric acid, or by dry etching using suitable etchant. In someembodiments, the formation of spacers, PAI process, formation of stressfilm, annealing, and removal of stress film described above are repeateda number of times to create multiple dislocations. Further details ofmultiple dislocations in the stress regions 252 are found in U.S. patentapplication Ser. No. 13/177,309, entitled “A Semiconductor Device with aDislocation Structure and Method of Forming the Same” and filed on Jul.6, 2011, which is incorporated herein by reference in its entirety.

After the stress film 240 is removed, optional dummy spacers 224* areformed on gate structure 220, in accordance with some embodiments. Insome embodiments, the dummy spacers 224* are used to define thedistances of subsequently formed doped regions from the channel regions.In some embodiments, the dummy spacers 224*, similar to gate spacers224, are formed over the gate spacers 224 by any suitable process to anysuitable thickness. The dummy spacers 224* include a dielectricmaterial, such as silicon nitride, silicon oxide, silicon oxynitride,other suitable materials, and/or combinations thereof.

Afterwards, recess regions are formed by etching process(es). In someembodiments, the etching process includes a dry etching process, wetetching process, or combination thereof. In some embodiments, theetching process utilizes a combination of dry and wet etching processes.The dry and wet etching processes have tunable etching parameters, suchas etchants used, etching temperature, etching solution concentration,etching pressure, source power, RF bias voltage, RF bias power, etchantflow rate, and other suitable parameters. In some embodiments, recessregions 282 are formed on substrate 210, as shown in FIG. 6 inaccordance with some embodiments. In some embodiments, a patternedphotoresist layer is utilized to define where the recess regions 282 areformed and protect other regions of the semiconductor device 200 fromimplantation damage. For example, in some embodiments, the PMOS regionsare protected. In addition, the patterned photoresist layer exposes thesource/drain regions, such that the source/drain regions are exposed tothe dry etch process 280 (forming amorphized region 282) while the gatestructure 220 (and other portions of the semiconductor device 200) areprotected from the etch process 280. For example, in some embodiments,the dry etching process utilizes an etching pressure of about 1 mTorr toabout 200 mTorr, a source power of about 200 W to about 2000 W, an RFbias voltage of about 0 V to about 100 V, and an etchant that includesNF₃, C₁₂, SF₆, He, Ar, CF₄, or combinations thereof.

After the etch process 280 is performed, the photoresist on substrate210 is removed. After the recess regions 282 are formed, substrate 210undergoes a wet etch to form recess regions 282*, as shown in FIG. 7, inaccordance with some embodiments. In some embodiments, the wet etchingsolutions include N_(H4)OH, HF (hydrofluoric acid), TMAH(tetramethylammonium hydroxide), other suitable wet etching solutions,or combinations thereof.

In some embodiments, the recess regions 282* have depths in a range fromabout 100 Å to about 800 Å. The widths of recess regions 282* nearsurface of substrate 210 are in a range from about 20 nm to about 200nm. As mentioned above, in some embodiments, the widths of recessregions 282* extend under spacer 224, 224* (not shown in FIG. 7), or acombination thereof.

Afterwards, a silicon-containing epitaxial structure 285 is formed ineach of the recesses 282*, as shown in FIG. 8, in accordance with someembodiments. The silicon-containing structure 285 is formed byperforming an epitaxial deposition process to form a silicon-containingepitaxial material, in some embodiments. In some embodiments, thesilicon-containing epitaxial material includes SiC, SiCP, SiP or othermaterial that produces tensile strain on the transistor channel region.In some embodiments, the silicon-containing material is formed by usinga silicon-containing precursor. For example, in some embodiments, gases,such as silane (Si_(H4)), disilane (S_(i2H6)), trisilane (S_(i3H8)),dichlorosilane (Si_(H2)C₁₂), etc., are used to form SiC-containingepitaxial material in structure 285. In some embodiments,phosphorous-containing gas, such as phosphine (P_(H3)), is used to formSiP epitaxial material or to form SiCP with a carbon-containing gas. Inother embodiments forming P-type transistors, the silicon-containingepitaxial material includes any material, such as SiGe, that producescompressive strain on the transistor channel region.

In some embodiments, the surface 286 of the silicon-containing epitaxialstructure 285 is level with or higher than the surface 223 (or interface223) of the substrate 210 and the gate structure 220. In someembodiments, the surface 286 has a height of up to about 300 Å above thesubstrate surface 223. Since the silicon-containing epitaxial structure285 is also epitaxial, the dislocations 260 continue in structure 285,as shown in FIG. 8, in accordance with some embodiments.

In some embodiments, the silicon-containing epitaxial material is formedby chemical vapor deposition (CVD), e.g., low pressure CVD (LPCVD),atomic layer CVD (ALCVD), ultrahigh vacuum CVD (UHVCVD), reducedpressure CVD (RPCVD), any suitable CVD, molecular beam epitaxy (MBE)process, any suitable epitaxial process; or any combinations thereof. Insome embodiments, the deposition of the silicon-containing epitaxialmaterial has a deposition temperature of about 750° C. or less. In otherembodiments, the etching temperature ranges from about 500° C. to about750° C. In some embodiments, the pressure of the deposition processranges from about 50 Torr to about 500 Torr.

Alternatively, the silicon-containing epitaxial material is formed byperforming an epitaxial deposition process to form a silicon-containingepitaxial material. Details of such process are described in U.S. patentapplication Ser. No. 13/029,378, entitled “Integrated Circuits andFabrication Methods Thereof” and filed on Feb. 17, 2011.

In some embodiments, the semiconductor device 200 undergoes further CMOSor MOS technology processing to form various features known in the art.For example, in some embodiments, the method 100 proceeds to form mainspacers. In some embodiments, contact features, such as silicideregions, are also formed. The contact features include silicidematerials, such as nickel silicide (NiSi), nickel-platinum silicide(NiPtSi), nickel-platinum-germanium silicide (NiPtGeSi),nickel-germanium silicide (NiGeSi), ytterbium silicide (YbSi), platinumsilicide (PtSi), iridium silicide (IrSi), erbium silicide (ErSi), cobaltsilicide (CoSi), other suitable conductive materials, and/orcombinations thereof. In some embodiments, the contact features areformed by a process that includes depositing a metal layer, annealingthe metal layer such that the metal layer is able to react with siliconto form silicide, and then removing the non-reacted metal layer. In someembodiments, an inter-level dielectric (ILD) layer is further formed onthe substrate 210 and a chemical mechanical polishing (CMP) process isfurther applied to the substrate to planarize the substrate. Further, insome embodiments, a contact etch stop layer (CESL) is formed on top ofthe gate structure 220 before forming the ILD layer.

In an embodiment, the gate stack 222 remains polysilicon in the finaldevice. In another embodiment, a gate replacement process (or gate lastprocess) is performed, where the polysilicon gate stack 222 is replacedwith a metal gate. For example, a metal gate replaces the gate stack(i.e., polysilicon gate stack) of the gate structure 220. The metal gateincludes liner layers, work function layers, conductive layers, metalgate layers, fill layers, other suitable layers, and/or combinationsthereof. The various layers include any suitable material, such asaluminum, copper, tungsten, titanium, tantalum, tantalum aluminum,tantalum aluminum nitride, titanium nitride, tantalum nitride, nickelsilicide, cobalt silicide, silver, TaC, TaSiN, TaCN, TiAl, TiAlN, WN,metal alloys, other suitable materials, and/or combinations thereof.

In some embodiments, subsequent processing further forms variouscontacts/vias/lines and multilayer interconnect features (e.g., metallayers and interlayer dielectrics) on the substrate 210, configured toconnect the various features or structures of the semiconductor device200. In some embodiments, the additional features provide electricalinterconnection to the device. For example, a multilayer interconnectionincludes vertical interconnects, such as conventional vias or contacts,and horizontal interconnects, such as metal lines. In some embodiments,the various interconnection features implement various conductivematerials including copper, tungsten, and/or silicide. In one example, adamascene and/or dual damascene process is used to form a copper relatedmultilayer interconnection structure.

The disclosed semiconductor device 200 is used in various applicationssuch as digital circuit, imaging sensor devices, a hetero-semiconductordevice, dynamic random access memory (DRAM) cell, a single electrontransistor (SET), and/or other microelectronic devices (collectivelyreferred to herein as microelectronic devices). Of course, aspects ofthe present disclosure are also applicable and/or readily adaptable toother type of transistor, including single-gate transistors, double-gatetransistors, and other multiple-gate transistors, and may be employed inmany different applications, including sensor cells, memory cells, logiccells, and others.

The embodiments of processes and structures described above providemechanisms for improving mobility of carriers. The dislocations in thesource and drain regions and the strain created by the doped epitaxialmaterials next to the channel region of a transistor both contribute tothe strain in the channel region. As a result, the device performance isimproved. In some embodiments, the NMOS transistor performance isincreased by about 10-25%.

One aspect of this description relates to a method of manufacturing asemiconductor device. The method includes performing a pre-amorphousimplantation (PAI) process to form an amorphized region on a substrate.The method also includes forming a stress film over the substrate, andperforming an annealing process to recrystallize the amorphized regionafter the stress film is formed. The method further includes forming arecess region on the substrate. The recess region overlies therecrystallized region. The method additionally includes forming anepitaxial stress-inducing material in the recess region.

Another aspect of this description relates to a method of manufacturinga semiconductor device. The method includes performing a pre-amorphousimplantation (PAI) process to form an amorphized region on a substrate,and forming a stress film over the substrate. The method furtherincludes forming at least one dislocation in the amorphized region,wherein a pinch off point of the at least one dislocation is spaced froma bottom edge of the amorphized region by a distance ranging from about10 nanometers (nm) to about 40 nm. The method further includes forming arecess region on the substrate, wherein the recess region overlies atleast a portion of the at least on dislocation, and forming an epitaxialstress-inducing material in the recess region.

Still another aspect for this description relates to a method of makinga semiconductor device. The method includes forming a first stressregion in a semiconductor substrate, the first stress region includingat least one dislocation. A gate structure is disposed over a channelregion of the semiconductor substrate. The method further includesforming a second stress region in the semiconductor substrate andoverlying the first stress region.

The above disclosure provides many different embodiments, or examples,for implementing different features of the invention. Specific examplesof components and arrangements are described above to simplify thepresent disclosure. These are, of course, merely examples and are notintended to be limiting. Accordingly, the components disclosed hereinmay be arranged, combined, or configured in ways different from theexemplary embodiments shown herein without departing from the scope ofthe present disclosure.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: performing a pre-amorphous implantation (PAI)process to form an amorphized region on a substrate; forming a stressfilm over the substrate; performing an annealing process torecrystallize the amorphized region after the stress film is formed;forming a recess region on the substrate, wherein the recess regionoverlies the recrystallized region; and forming an epitaxialstress-inducing material in the recess region.
 2. The method of claim 1,wherein the recrystallized region includes at least one dislocation. 3.The method of claim 1, wherein performing the PAI process includesimplanting the substrate with silicon (Si) or germanium (Ge) implantspecies.
 4. The method of claim 1, wherein the annealing processincludes a rapid thermal annealing (RTA) process, a millisecond thermalannealing (MSA) process, or a microsecond thermal annealing (OA)process.
 5. The method of claim 1, wherein the epitaxial stress-inducingmaterial includes SiC, SiP, or SiCP.
 6. The method of claim 1, whereinforming the recess region utilizes a wet etch after a dry etch.
 7. Themethod of claim 1, further comprising: forming spacers on each side of agate stack, wherein the gate stack is on the substrate.
 8. The method ofclaim 1, wherein performing the PAI processes comprises forming theamorphized region having a depth ranging from about 10 nm to about 150nm.
 9. The method of claim 1, wherein performing the PAI processcomprises implanting a species in the substrate, wherein the speciescomprises at least one of silicon, germanium, argon, xenon, or borondifluoride.
 10. The method of claim 1, wherein performing the PAIprocess comprises implanting a species in the substrate at a temperatureranging from about −100° C. to about 25° C.
 11. The method of claim 1,wherein performing the PAI process comprises implanting a species in thesubstrate in a concentration ranging from about 1×10¹⁴ atoms/cm² toabout 2×10¹⁵ atoms/cm².
 12. The method of claim 1, wherein forming thestress film comprises forming the stress film to retard a growth rate inthe direction of the amorphized region.
 13. The method of claim 1,wherein forming the recess region comprises forming the recess regionhaving a depth ranging from about 100 angstroms (Å) and about 800 Å anda width at a surface of the substrate ranging from about 20 nm to about200 nm.
 14. A method of manufacturing a semiconductor device, the methodcomprising: performing a pre-amorphous implantation (PAI) process toform an amorphized region on a substrate; forming a stress film over thesubstrate; forming at least one dislocation in the amorphized region,wherein a pinch off point of the at least one dislocation is spaced froma bottom edge of the amorphized region by a distance ranging from about10 nanometers (nm) to about 40 nm; forming a recess region on thesubstrate, wherein the recess region overlies at least a portion of theat least on dislocation; and forming an epitaxial stress-inducingmaterial in the recess region.
 15. The method of claim 14, whereinforming the at least one dislocation comprises performing a rapidthermal anneal process, a millisecond thermal anneal process, or amicrosecond thermal anneal process.
 16. The method of claim 14, whereinforming the at least on dislocation comprises: performing a pre-heatingprocess; and performing a main heating process after the pre-heatingprocess.
 17. The method of claim 16, wherein performing the pre-heatingprocess comprises heating the substrate at a first temperature rangingfrom about 200° C. to about 700° C. for a first duration ranging fromabout 10 seconds to about 10 minutes, and performing the main heatingprocess comprises heating the substrate at a second temperature rangingfrom about 800° C. to about 1400° C. for a second duration ranging fromabout 1 millisecond to about 5 hours.
 18. The method of claim 14,wherein forming the recess region comprises performing a dry etchingprocess using an etchant comprising at least one of NF₃, Cl₂, SF₄, He,Ar, or CF₄.
 19. The method of claim 14, wherein forming the recessregion comprises performing a wet etching process using an etchantcomprising at least one of NH₄OH, HF, or TMAH.
 20. A method of making asemiconductor device, the method comprising: forming a first stressregion in a semiconductor substrate, the first stress region includingat least one dislocation, wherein a gate structure is disposed over achannel region of the semiconductor substrate; and forming a secondstress region in the semiconductor substrate and overlying the firststress region, wherein the at least one dislocation is continuous fromthe first stress region to the second stress region.